Laser separation technology mainly refers to laser cutting and laser drilling technology. Laser separation technology is to focus on energy to tiny space, may obtain 105 ~ 1015 w/cm2 extremely high radiation power density, using the high density of energy of non-contact, high speed, high precision machining method. In such a high power density, light can on almost any material in laser cutting and perforation. Laser cutting technology is a kind of get rid of the traditional mechanical cutting, heat treatment, cutting, such as the new cutting method, has higher precision, lower roughness, more flexible cutting method and higher production efficiency, etc. Laser drilling method as one machining hole in the solid material, has become a has a specific application of processing technology, mainly used in aviation, aerospace and microelectronics industries.